Amkor Technology, Inc. (AMKR)

業務介紹

安克科技公司(Amkor Technology, Inc.)在美國、日本、歐洲、中東、非洲和亞太地區其他地區提供半導體封裝和測試外包服務。它提供包括半導體晶圓凸點、晶圓探針、晶圓背面研磨、封裝設計、封裝、測試和直接發貨服務的一站式封裝和測試服務。該公司還提供用於智能手機、平板電腦和其他移動消費電子設備的翻轉晶片尺度封裝產品;用於在移動設備中堆疊記憶體於數字基帶和應用處理器之上的翻轉晶片堆疊尺度封裝;以及用於各種網絡、存儲、計算和消費應用的翻轉晶片球柵陣列封裝。此外,它還提供用於電源管理、收發器、傳感器、無線充電、解碼器、雷達和特殊硅的晶圓級CSP封裝;用於集成電路的晶圓級扇出封裝;以及用較薄結構取代層壓基板的矽晶圓集成扇出技術。該公司還提供用於低到中引腳計數模擬和混合信號應用的引腳框封裝;用於將晶片連接到基板的基板線鍵封裝;微電子機械系統(MEMS)封裝,這是微型機械和電子機械設備;以及用於射頻和前端模塊、基帶、連接性、指紋傳感器、顯示和觸摸屏驅動器、傳感器和MEMS,以及NAND存儲器和固態驅動器的先進系統級封裝模塊。它主要為集成設備製造商、無晶圓半導體公司、原始設備製造商和合同晶圓廠提供服務。安克科技公司成立於1968年,總部位於亞利桑那州坦佩。



Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

公司網址

https://amkor.com