最後更新 2024-11-14 08:27:52 (UTC+8)

基本分析

透過季節調整季營收,判斷美股整體趨勢,但注意股價有時候領先基本面的數據,應搭配其他領先指標判斷。

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季節調整季營收
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截至2024-06-30

基本資料

個股的基本資料,以及所屬的類股和產業。

公司介紹

業務介紹

ASE Technology Holding Co., Ltd.在美國、台灣、亞洲其他地區、歐洲和國際上提供各種半導體封裝和測試以及電子製造服務。它提供的封裝服務包括:翻轉晶片球柵陣列(BGA)和晶片尺度封裝(CSP)、先進的晶片尺度封裝、四引腳扁平封裝、低剖面和薄四引腳扁平封裝、凸塊晶片載體和四引腳無引腳(QFN)封裝、先進的QFN封裝、塑料BGA和3D晶片封裝;各種封裝中的堆疊晶片解決方案;以及銅線和銀線鍵合解決方案。該公司還提供先進封裝,如翻轉晶片BGA;散熱器FCBGA;翻轉晶片CSP;混合FCCSP;翻轉晶片封裝在封裝和封裝在封裝(POP);先進的單面基板;高帶寬POP;扇出晶圓級封裝;SESUB;以及2.5D矽載體。此外,它還提供IC線鍵合封裝;系統級封裝產品(SiP)和模組;以及互連材料,並組裝汽車電子產品。此外,該公司還提供一系列半導體測試服務,包括前端工程測試、晶圓探針、邏輯/混合信號/射頻模組和SiP/MEMS/離散元件最終測試,以及其他測試相關服務,以及直接發貨服務。此外,它還開發、建造、出售、租賃和管理房地產;生產基板;提供信息軟件、設備租賃、投資諮詢和倉儲管理服務;加工和銷售電腦和通信外圍設備、電子元件、電信設備和主板;並進出口商品和技術。該公司成立於1984年,總部位於台灣高雄。



ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.

所屬產業

所屬類股
Technology
所屬產業
Semiconductors

警語

1. 資料僅供參考,不做任何獲利保證及特定股票與點位推薦建議。

2. 資料並不完整,需要完整資料請至相關網站索取。

3. 任何股市數據分析皆存在倖存者偏差。

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